Semiconductors – Pagina 17

1 Gennaio 1970Tecnologia

Bill Gates-backed silicon photonics startup develops optical transistors 10,000x smaller than current tech — optical chip can process 1,000 x 1,000 multiplication matrices

Neurophos, an AI chip started based in Austin, Texas and backed by Bill Gates’ Gates Frontier Fund, says that it has developed […]

1 Gennaio 1970Tecnologia

US lawmakers aim to ban export of DUV chipmaking and etching tools to leading firms in China — bipartisan proposal would ban lithography equipment for Huawei, SMIC, and others

A bipartisan group of U.S. senators has proposed a new law that would impose an almost blanked ban on exports of advanced […]

1 Gennaio 1970Tecnologia

Intel details progress on fabbing 2D transistors a few atoms thick in standard high volume fab production environment — chipmaker outlines 300-mm fab compatible with integration of 2D transistor contacts and gate stacks

2D transistors based on 2D materials have been demonstrated in academia and research labs for more than a decade, but none of […]

1 Gennaio 1970Tecnologia

Ongoing trade war has TSMC and Taiwan stuck between a rock and a hard place — concerns mount surrounding U.S deals cracking the nation’s silicon shield

On January 15, Taiwan and the United States of America signed a significant trade deal. On its side, Taiwan earmarked a total […]

1 Gennaio 1970Tecnologia

Honda to temporarily shut down factories in China and Japan because of chip shortage — disruption caused by fallout from on-going conflict within Nexperia

Honda has announced that it will suspend production at several sites in Japan on January 5 and 6, with reduced operations until […]

1 Gennaio 1970Tecnologia

Nvidia CEO denies that US wants to shift 40% of Taiwan’s chipmaking capacity to America — Jensen Huang says onshoring is all new capacity, will preserve island nation’s silicon shield

Jensen Huang, chief executive of Nvidia, has rebuffed claims that the U.S. intends to shift 40% of Taiwan’s semiconductor capacity to the […]

1 Gennaio 1970Tecnologia

YMTC’s third Wuhan fab clears Beijing’s 50% local tooling threshold as two more are planned — move positions company toward 3D NAND production to capitalize on wafer bonding strengths

China’s Yangtze Memory Technologies is expected to start operations at its Phase 3 Wuhan fab late this year as the first leading-edge […]

1 Gennaio 1970Tecnologia

LG enters chip packaging arena with Laser Direct Imaging machine, as TSMC’s CoWoS remains constrained — maskless machine is designed to pattern fine interconnects, trading resolution for higher throughput

As advanced packaging technologies like EMIB and CoWoS become yet another battlefield in the semiconductor industry, outsourced semiconductor assembly and test (OSAT) […]

1 Gennaio 1970Tecnologia

Taiwan considers TSMC export ban that would prevent manufacturing its newest chip nodes in U.S. — limit exports to two generations behind leading-edge nodes, could slow down U.S. expansion

Being concerned that TSMC’s expansion into the United States could dilute Taiwan’s semiconductor leadership, Taiwanese authorities are mulling setting a new export […]

1 Gennaio 1970Tecnologia

China moves into manufacturing disruptive new semiconductor glass substrates as processor packaging competition intensifies

Glass wafer materials are emerging as a potential and viable alternative to their more conventional, aged organic counterparts. Replacing plastic-based cores with […]