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Tag: Semiconductors

21 Ottobre 2026Tecnologia

ASML and other critical semiconductor equipment suppliers expedite shipments to Musk’s Terafab

Share this article Join the conversation Follow us Add us as a preferred source on Google Newsletter Subscribe to our newsletter Elon […]

16 Ottobre 2026Tecnologia

China startup demoes prototype EUV light source

Being unable to procure EUV litho tools from ASML, China must develop such systems locally, so from time to time we learn […]

8 Ottobre 2026Tecnologia

GlobalFoundries to produce silicon interposers for TSMC’s CoWoS in the US — Five-year agreement valued at $2 billion

GlobalFoundries and TSMC have entered into a five-year manufacturing agreement valued at $2 billion under which GlobalFoundries will produce silicon interposers for […]

8 Ottobre 2026Tecnologia

Department of War dishes out $1.5 billion loan commitment to boost semiconductor supply chain

U.S. Semiconductor Manufacturer Wolfspeed Inc. has received a conditional 30-year, $1.5 billion loan commitment letter from the U.S. Department of War (DoW) […]

3 Ottobre 2026Tecnologia

Elon Musk confirms discussions with TSMC about Terafab chipmaking collaboration

TSMC and Elon Musk’s Terafab semiconductor production initiative are discussing a potential collaboration under which TSMC would build and operate a facility […]

28 Settembre 2026Tecnologia

Synopsys debuts Autopilot platform for developing chips autonomously using AI

Synopsys announced its AgentEngineer solutions, a portfolio of “domain-specific long-horizon agents” built on its new Autopilot Platform. As the company details in […]

8 Settembre 2026Tecnologia

TSMC to start using High-NA EUV lithography in 2030 — A10 or A11 technology prime candidates for use

For years, TSMC has tried to avoid making public comments about its plans to use EUV lithography with a 0.55 numerical aperture […]

2 Settembre 2026Tecnologia

The current state of Hybrid Bonding in 2026 — TSMC sits at 6 microns and the HBM delay that nobody expected

Hybrid bonding, the copper-to-copper joining technique that replaces solder microbumps in 3D chip stacks, is in high-volume production on logic chips and […]

20 Agosto 2026Tecnologia

Synopsys validates a PCIe 6.0 PHY inside a face-to-face 3D stack at 64 GT/s — says it got there by pulling apart an existing 2D test chip

Synopsys has published silicon results for what it calls the first 3D PCIe 6.0 test chip, a 5nm PHY built into a […]

11 Agosto 2026Tecnologia

Intel raises $19.7 billion to help fund future projects as 14A production looms — share sale attracted $100 billion in demand, report claims

Intel is set to raise $19.7 billion by selling new common stock in a bid to finance the building out of new […]

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