ASML and other critical semiconductor equipment suppliers expedite shipments to Musk’s Terafab
Share this article Join the conversation Follow us Add us as a preferred source on Google Newsletter Subscribe to our newsletter Elon […]
Tag: manufacturing
China startup demoes prototype EUV light source
Being unable to procure EUV litho tools from ASML, China must develop such systems locally, so from time to time we learn […]
GlobalFoundries to produce silicon interposers for TSMC’s CoWoS in the US — Five-year agreement valued at $2 billion
GlobalFoundries and TSMC have entered into a five-year manufacturing agreement valued at $2 billion under which GlobalFoundries will produce silicon interposers for […]
Department of War dishes out $1.5 billion loan commitment to boost semiconductor supply chain
U.S. Semiconductor Manufacturer Wolfspeed Inc. has received a conditional 30-year, $1.5 billion loan commitment letter from the U.S. Department of War (DoW) […]
Elon Musk confirms discussions with TSMC about Terafab chipmaking collaboration
TSMC and Elon Musk’s Terafab semiconductor production initiative are discussing a potential collaboration under which TSMC would build and operate a facility […]
Synopsys debuts Autopilot platform for developing chips autonomously using AI
Synopsys announced its AgentEngineer solutions, a portfolio of “domain-specific long-horizon agents” built on its new Autopilot Platform. As the company details in […]
TSMC to start using High-NA EUV lithography in 2030 — A10 or A11 technology prime candidates for use
For years, TSMC has tried to avoid making public comments about its plans to use EUV lithography with a 0.55 numerical aperture […]
The current state of Hybrid Bonding in 2026 — TSMC sits at 6 microns and the HBM delay that nobody expected
Hybrid bonding, the copper-to-copper joining technique that replaces solder microbumps in 3D chip stacks, is in high-volume production on logic chips and […]
Motorless solid-state cooler uses heat to cool itself; could recycle processor heat into cooling — shape-memory alloy films could turn data center exhaust into refrigeration
A team of scientists in Germany and Japan has demonstrated a solid-state cooling system that uses heat to generate the mechanical work […]
Glass substrate roadmaps examined — Absolics in final qualification and a first product that keeps slipping
Glass-core substrates, the replacement for organic chip packaging that Intel promised in September 2023 with more than $1 billion behind it, are […]