TSMC to start using High-NA EUV lithography in 2030 — A10 or A11 technology prime candidates for use
For years, TSMC has tried to avoid making public comments about its plans to use EUV lithography with a 0.55 numerical aperture […]
Tag: manufacturing
The current state of Hybrid Bonding in 2026 — TSMC sits at 6 microns and the HBM delay that nobody expected
Hybrid bonding, the copper-to-copper joining technique that replaces solder microbumps in 3D chip stacks, is in high-volume production on logic chips and […]
Motorless solid-state cooler uses heat to cool itself; could recycle processor heat into cooling — shape-memory alloy films could turn data center exhaust into refrigeration
A team of scientists in Germany and Japan has demonstrated a solid-state cooling system that uses heat to generate the mechanical work […]
Glass substrate roadmaps examined — Absolics in final qualification and a first product that keeps slipping
Glass-core substrates, the replacement for organic chip packaging that Intel promised in September 2023 with more than $1 billion behind it, are […]
Synopsys validates a PCIe 6.0 PHY inside a face-to-face 3D stack at 64 GT/s — says it got there by pulling apart an existing 2D test chip
Synopsys has published silicon results for what it calls the first 3D PCIe 6.0 test chip, a 5nm PHY built into a […]
Intel raises $19.7 billion to help fund future projects as 14A production looms — share sale attracted $100 billion in demand, report claims
Intel is set to raise $19.7 billion by selling new common stock in a bid to finance the building out of new […]
Hyperscalers commit nearly $2 trillion to secure AI hardware and memory — Google leads $811 billion spending surge while Apple trails at $57 billion
Apple used to be among a few companies willing to buy memory and other components worth billions of dollars under long-term supply […]
Chinese chipmaking tool roadmaps examined — Beijing’s nascent lithography tools target DUV production at five machines a year, and an EUV prototype with no chips
China has started low-volume production of domestically developed immersion DUV lithography machines, with around five systems planned for this year and roughly […]
Lumentum CEO warns of impending bottleneck on critical material used for silicon photonics — fab and material shortfall already lags 30% below customer needs as co-packaged optics demand skyrockets
Lumentum CEO Michael Hurlston told an audience at the RAISE Summit in Paris earlier this month that indium phosphide, the compound semiconductor […]
SMIC’s third-gen 7nm node shows smaller metal pitch than Intel 18A, higher transistor density than TSMC N6 without EUV — analysis of N+3 shows significant advancement for Chinese semi manufacturing
An analysis of Huawei’s Kirin 9030 system-on-chip (SoC) for smartphones conducted by SemiAnalysis revealed that SMIC’s third-generation 7nm-class fabrication technology (N+3) has […]